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Special micro powder for diamond wire saw

The raw material adopts high technology, high strength and high quality diamond, through special processing procedures, the product crystal is more regular, good sharpness, particle size distribution is extremely concentrated, high strength of micropowder particles, effective grinding particles are concentrated, the impurity content is very low, with good dispersion and wear resistance.

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Semiconductor material cutting grinding powder

Using high-strength, high-grade diamond as raw materials, after fine crushing process production, particle size is highly concentrated, crystal form is more regular, high particle strength, high cutting efficiency, good dispersion and wear resistance.

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LMP

High-quality diamond with high strength and low impurities has uniform particle size distribution, better thermal stability and wear resistance; the surface of the particles is specially processed, which is more conducive to the stable growth of PCD/PD.

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LMF

It is suitable for polishing various electroplating and ceramic tools, sapphire and other precision devices.

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LMR

Suitable for resin tools, resin grinding wheels and other general applications in stone, glass, ceramics and other processing fields.

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XP series of diamond powder, crystal similar to the sponge, the use of the outer surface force easily broken and fall off, forming a new cutting edge. It is suitable for processing silicon wafer, sapphire, precision ceramics, optical lens, optical fiber communication field, etc.

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