Semiconductor material cutting grinding powder
Using high-strength, high-grade diamond as raw materials, after fine crushing process production, particle size is highly concentrated, crystal form is more regular, high particle strength, high cutting efficiency, good dispersion and wear resistance.
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Introduction
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Using high-strength, high-grade diamond as raw materials, after fine crushing process production, particle size is highly concentrated, crystal form is more regular, high particle strength, high cutting efficiency, good dispersion and wear resistance.
Use:Especially suitable for silicon carbide semiconductor material cutting edge material and grinding, polishing processing.
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SAF Coolest v1.3 设置面板 FZTSX-ZGYF-OVAFE-ZFF
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