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Special micro powder for diamond wire saw

The raw material adopts high technology, high strength and high quality diamond, through special processing procedures, the product crystal is more regular, good sharpness, particle size distribution is extremely concentrated, high strength of micropowder particles, effective grinding particles are concentrated, the impurity content is very low, with good dispersion and wear resistance.

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Introduction

The raw material adopts high technology, high strength and high quality diamond, through special processing procedures, the product crystal is more regular, good sharpness, particle size distribution is extremely concentrated, high strength of micropowder particles, effective grinding particles are concentrated, the impurity content is very low, with good dispersion and wear resistance.

Use:It is mainly used for the manufacture of cutting tools such as diamond wire saw, and also for the rough grinding and fine grinding tools for processing monocrystalline silicon, polycrystalline silicon, diamond, gem, sapphire, quartz, LED sapphire substrate, liquid crystal glass, high-precision magnetic materials, semiconductors and other high-tech materials.

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Semiconductor material cutting grinding powder